型号/品牌/封装
品类/描述
库存
价格(含税)
资料
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 38电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits, Tin (Sn) Plating
3988
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 46电路 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits
6854
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
8753
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 28电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating
6414
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 34电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, Tin (Sn) Plating
6591
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 24电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, Tin (Sn) Plating
2355
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 46电路, 0.38μm ( 15μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
9358
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 48电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, Tin (Sn) Plating
7088
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 50电路, 0.76μm ( 30μ ),金(Au )选择性电镀,锡(Sn ) PC尾电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
7240
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 32电路, 0.76μm ( 30μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
9252
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 64电路, 0.38μm ( 15μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
4006
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 26电路, 0.76μm ( 30μ ),金(Au )选择性电镀,锡(Sn ) PC尾电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
7964
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 16电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
8654
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路26 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits
9535
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
9895
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
5382
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 32电路, 0.76μm ( 30μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
9834
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
8866
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
3437
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
8219
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
2849
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
9661
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 32电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2199
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 46电路, 0.76μm ( 30μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
7174
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路42 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits
1034
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
4192
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 52电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, Tin (Sn) Plating
8966
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 40电路, 0.76μm ( 30μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
3360
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
8133
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描述:
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
3190
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